• 3: About
  • 3.1: Sherry Garber
  • 3.2: Bob Merritt
• 4: Services
  • 4.1: Market Trends
  • 4.2: Market Conditions
  • 4.3: Research & Analysis
  • 4.4: Expert Witness
• 5: Reports
  • 5.1: Memory Market Conditions: DRAM / NAND
  • 5.2: Conventional and New Memory Market and Technology Reports
  • 5.3: Battery Market and Technology Trends
  • 5.4: Enterprise SSD: Complexities and Opportunities
  • 5.5: Server Platform as Market Entry Point for New and Emerging Memory Technologies
  • 5.6: DRAM Landscape: Alliances
  • 5.7: DRAM in the Age of Mobile
  • 5.8: White Papers
  • 5.9: Hybrid Packaging Reports
  • 5.10: Technology Evolution Reports
  • 5.11: Targeted Custom Consulting for Semiconductor Strategies on Significant Industry-Wide Issues
• 7: News & Events
  • 7.1: Convergent's Observations
  • 7.2: Press Releases
• 8: Contact
• 11: Clients
• 13: Glossary
  • 13.1: 2.5D IC
  • 13.2: 3D-IC
  • 13.3: BEOL
  • 13.4: CBRAM
  • 13.5: DRAM
  • 13.6: FCRAM
  • 13.7: FRAM
  • 13.8: GDDR DRAM
  • 13.9: Hybrid Device
  • 13.10: Hybrid Package
  • 13.11: MRAM
  • 13.12: Microbump
  • 13.13: MCP
  • 13.14: NAND Flash
  • 13.15: Nonvolatile
  • 13.16: NOR Flash
  • 13.17: NRAM
  • 13.18: PRAM
  • 13.19: RRAM
  • 13.20: Silicon Interposer
  • 13.21: SSD
  • 13.22: STT-RAM
  • 13.23: SRAM
  • 13.24: SIP
  • 13.25: TSV

MCP

Multi-Chip Package provides small form factor by combining two to ten die in a package. Widely implemented in mobile products.

© 2012 Convergent Semiconductors. All rights reserved.