Press
08/30/10
Hybrid Devices-The Memory Market's New High Value Product Category
What are Hybrid Devices and why will it move the semiconductor industry forward?
This report outlines the market opportunities, market and financial drivers, financial opportunities, near-term technology enablers required for introduction, and technology hurdles and market challenges for advanced Hybrid Devices.
Hybrid Devices Promises High Impact on Consumer Electronics
How can key technology events be evaluated to predict Consumer Electronics Trends?
This report examines steps to acceptance and success of a consumer product. Hybrid Devices can have a significant revenue growth impact for new memory products for Consumer Electronics. Hybrid Devices with their inherent flexibility promise to significantly alter the architecture of Consumer devices, shift BOM (Bill of Material) costs to variable purchase plug-in Hybrid Devices, enhance competitive differentiation, and provide for early adoption of new memory technologies.
Conventional Memory and the Impact of Hybrid Devices
How does memory technology adapt to enable the rapidly evolving consumer mobile market?
Hybrid Devices provides numerous advantages to OEMs as well as to memory manufacturers. By using HD versus conventional discrete memory in a design, the risk of adoption of any new memory type would be reduced. Early confirmation of acceptability reduces investment risk, and the period required to become a mainstream product. Multiple packaging options allow greater flexibility in feature sets, and in the mix of volatile and non-volatile memory solutions.Market acceptance of HD concepts in the Consumer segment demonstrates the current state of the art and confirms the attributes of flexibility and lower manufacturing costs. Market acceptance of HD concepts in the Consumer segment demonstrates the current state of the art and confirms the attributes of flexibility and lower manufacturing costs.
The Impact of Hybrid Devices on the ASSP Market
Why are Hybrid Device concepts impacting the ASSP Market?
In the next decade, as designs cross the 30nm lithography boundary and approach 12nm, Hybrid Devices that incorporate standard memory, new memory, logic, processors, and analog on a single fabrication process will again transform the platform IC market and many types of Hybrid Devices will displace current ASSP devices as a preferred choice for custom platform IC products.
Four Generations of Hybrid Devices Enable Now and Future Smartphone Market
How can each of the four generations of HD enhance the features of the Smartphone?
Hybrid Devices will accelerate the shift in Smartphone system architecture by moving BOM costs from the core phone to the accessory Hybrid Devices. This will accomplish the rapid transition to a Cognitive Radio Smartphone that will use the wireless spectrum more efficiently. HD will enable vendors to add functionality without incurring additional base handset costs.
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05/08/10
Details of additional reports will be made available as reports are competed.
Click below for a partial list of scheduled additional reports.
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Hybrid Device Series of Studies Addresses the Convergence of Three Significant Future Trends
As the IC industry begins to look toward high performance mobile applications for the inspiration of new products, the value proposition of the infrastructure technologies also shifts. New packaging technologies, new design and test concepts, and new materials are necessary to improve the time-to-market while providing a richer set of features tailored to individual users. These goals are already being addressed by diverse elements within the industry, and we are finding a constantly expanding array of tools for those manufacturers to whom this vision has become their unspoken new product development strategy.
Convergent Semiconductors and Edison Labs LLC identify infrastructure support and opportunities for this emerging class of Hybrid Device technologies in an expanding set of reports. Contact us for more details.
We are pleased to announce the availability of additional new reports written in conjunction with Edison Labs LLC that identifies Hybrid Devices as a dynamic and growing class of new semiconductor products. Hybrid Devices incorporate standalone memory (DRAM, FLASH, SRAM, and new emerging memory technologies) with logic or analog circuits into a single IC device. These devices can be used as a standalone advanced memory device or with all the enhanced digital/analog features that additional logic can bring. The ability of the Hybrid Devices to provide application-specific high-performance memory defines its hybrid qualities and also enables rapid market acceptance of this new product category. Hybrid Devices will enable an expanded set of performance attributes over the next decade. Because these devices will create new Intellectual Property and competitive advantages for those who enter the market early, this report details market opportunities where the first mover will gain a large and sustaining advantage over companies that wait until the trends are well established. Contact us for more details at: bobm@convergentsemiconductors.com sherryg@convergentsemiconductors.com
Our Latest Articles
02/12/10
The nice thing about 2010 is that the revenue projections for semiconductor manufacturers, OEMs and the economy as a whole are much brighter than the projections were a year ago for 2009. Even the DRAM industry is optimistic about revenue-for a change. Demand is increasing both on the PC side and the consumer product side. Supply is expected to be tight for the year as growth begins to make an impact in the end markets in the second quarter.
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01/21/10
(Excerpt from our recently released report)
Once the concept of Hybrid Memory is acknowledged, it is easy to recognize that the industry has already firmly transitioned into the first phase with products based on multi-chip packaging and thru-silicon via technologies (TSV's) already capturing rapidly growing market opportunities.
Each stage of the development of the Hybrid Memory category has different technology needs and is currently at different stages of readiness. In the following table, we have focused on six critical technology barriers as Hybrid Memory progresses through four classes of devices.
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