Press
11/16/09
Everspin Technologies is introducing the world's first serial interface magneto-resistive random access memory (MRAM) family of products. These high performance non-volatile memory products are designed to enhance systems using the increasingly popular Serial Peripheral Interface (SPI) bus now common on many microprocessors, microcontrollers and other integrated circuits.
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10/28/09
Researchers from Intel Corp. and Numonyx BV, announced the ability to stack multiple layers of phase-change memory (PCM) arrays within a single die, a breakthrough that could pave the way for PCM to one day displace multiple existing memory technologies in various applications.
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09/16/09
The Flight Control Computer in the advanced A350 XWB aircraft uses MRAM for critical program and data storage in extreme environment applications.
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06/25/09
Both companies expecting to have compliant devices available in 2010.
"An interface standard supported by multiple suppliers is a key element in establishing any potentially high-volume memory technology," said Bob Merritt.
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Hybrid Memory Device Series of Studies
We are pleased to announce the first study in a series of new reports written in conjunction with Edison Labs LLC that identifies Hybrid Memory devices, a dynamic and growing class of new semiconductor products.
Hybrid Memory devices incorporate standalone memory (DRAM, FLASH, SRAM, and new emerging memory technologies) with logic or analog circuits into a single IC device. These devices can be used as a standalone advanced memory device or with all the enhanced digital/analog features that additional logic can bring. The ability of the Hybrid Memory devices to provide application-specific high-performance memory defines its hybrid qualities and also enables rapid market acceptance of this new product category.
Hybrid Memory devices will enable an expanded set of performance attributes over the next decade. Because these devices will create new Intellectual Property and competitive advantages for those who enter the market early, this report details market opportunities where the first mover will gain a large and sustaining advantage over companies that wait until the trends are well established.
The price of this initial report is $4,995, which can be applied to the $35,000 for the complete set of 10 reports focusing on this exciting new product opportunity.
Introduction to Hybrid Memory 1
Overview of the Memory Market 2
Why Hybrid Memory Makes Sense for the Memory Market 4
The Role of Multi-Chip Packages and Modules 6
Economic Impact in the Package Hybrid Memory Phase 12
Market Entry Point of Hybrid Memory 14
Economic Impact in the Sandwich Hybrid Memory Phase 16
Impact on Later stages
Some Conclusions on the Economic Impact
Shift in Value Ratio between Memory and Logic 19
Hybrid Memory Attributes 20
Common Hybrid Memory Attributes
Optional Hybrid Memory Attributes
Limitations of Hybrid Memory Devices
Evolutionary Path of Hybrid Memory 22
Classes and Phases of Hybrid Memory Devices
Phase 1-Package Hybrid Memory
Phase 2-Sandwich Hybrid Memory
Phase 3-Partial Hybrid Memory
Partial Hybrid Memory Products
Phase 4: Full Hybrid Memory
Memory Market Income Profile 28
Memory versus Logic and Processor Price Curves
The Foundry Dilemma
ROI analysis
Limited Product Differentiation for Memory Devices
Summary of Current Market Conditions
Hybrid Memory Changes the Market Dynamics
Improved Financials
Can Hybrid Memory Devices be Produced Now?
Support from Digital Logic IP Core Suppliers
Merging Memory and Logic Fab Processes
Market Entry Points for Hybrid Memories 35
Defense
Communications
Automotive
Enterprise, Cloud Services, and Data Comm
Data Storage
Personal, Mobile and Embedded Computing
Security and Encryption
Computing
Consumer
Audio/Video and Digital Imaging
Hybrid Memory Navigation Modules
Consumer Electronics
Technology Requirements for Each Stage 44
First Phase-Package Hybrid 46
Foundry Process
Memory
IC Packaging and Test
CAD tools
OS Software
Standards
Second Phase-Sandwich Hybrid 48
Third Phase-Partial Hybrid 50
Fourth Phase-Full Hybrid 52
Long-Term Market Implications 54
Contact us at bobm@convergentsemiconductors.com or sherryg@convergentsemiconductors.com for more details.
Our Latest Articles
01/21/10
(Excerpt from our recently released report)
The memory market currently has reached the precarious state of attempting to fund impending crucial large capital investments in a mature market burdened by commodity pricing. Opportunities for memory products have been characterized as very competitive markets of very great size, but typically with very small profit margins. Historic sales and profit/loss for memory manufacturers continue to rise and fall according to market conditions and clearly demonstrate the commodity nature of the product.
With limited opportunities to differentiate memory products, commodity pricing is now an unchanging market characteristic for memory manufacturers, and with the trend toward-or at least the goal of-a single universal standard product that supports the widest number of applications, these market characteristics have become accepted as the signature model of memory production.
The question to ask is whether a different and more profitable model for memory companies is possible.
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01/21/10
(Excerpt from our recently released report)
Once the concept of Hybrid Memory is acknowledged, it is easy to recognize that the industry has already firmly transitioned into the first phase with products based on multi-chip packaging and thru-silicon via technologies (TSV's) already capturing rapidly growing market opportunities.
Each stage of the development of the Hybrid Memory category has different technology needs and is currently at different stages of readiness. In the following table, we have focused on six critical technology barriers as Hybrid Memory progresses through four classes of devices.
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